Dicing Tape

Basic Information
and Characteristics Special Tape for Wafer Dicing Process (Strong Adhesion, Easy Delamination after UV Exposure, No Contamination/Damage)

Dicing Tape is a special tape used in the semiconductor manufacturing process, specifically during the wafer (silicon wafer) processing stage known as dicing. This tape is attached to the surface of the semiconductor wafer, providing stable fixation of chips during the dicing (slicing) process and assisting in cutting and dividing the wafer.

Dicing Tape is a crucial material in the semiconductor manufacturing industry, essential for securely fixing and protecting various parts of semiconductor wafers.