QFN Tape

Basic Information
and Characteristics Special Tape for Semiconductor Package Process Backside (High Heat Resistance, Excellent Adhesion, No Residu on High-Temperature processes)

This refers to a special tape used for handling semiconductor products of the package type. QFN has a flat package design without lead and is used to safely handle semiconductor chips of such packages in production and various processes.

QFN Tape is a crucial material, especially for manufacturers using QFN packages in the semiconductor industry, providing convenience in production and quality control processes. This tape ensures precise component placement and safe protection, contributing to improved product quality and increased productivity.